Quality is our #1 “Goal to meet and exceed our Customers’ Expectations”
Here are areas we exceed in.
DPPM = Defective Parts Per million – Goal is 300 DPPM
SPC = Statistical Process Control
Chart types Pareto, Bar, X bar and Y, Cause and effect
Cause of defect – Root cause and effect process
We Build the Quality in our process to prevent any returns from our customer.
We keep our employees up to date on all Quality improvements.
Every build on the production line has work Instruction that follows the process to completion. With Employees signature at each Work station with Quality Check Points signed off by QA personnel
Quality PCB - final assembly inspection machines info
X-Ray Machine
can provide high-resolution images of BGA’s , Micro BGA’s and other chip scale packages
75kV, 0.250mA, X-Ray Source
Digital X-Ray Control
4'' Image Intensifier
25X - 200X Magnification
Up to 18'' x 27'' PCB
Manual X-Y table
Image Analysis Software
- PCB Equipment & Testing Capability (with other vendors)
More PCB equipment info
Semi-Automatic Stencil Printer
PCB Handling
PCB size max.: 430 x 570 mm with standard PCB clamping: 350 x 450 mm
PCB thickness max.: 6 mm
Stencil size min. 300 x 300 mm, up to 630 x 850 mm.
Frame thickness 30 mm, adjustable without adapter
Print Parameter
Print area max. : 430 x 570 mm
Print speed 10-110 mm/sec.
Print pressure 0-4 bar
Separation speed 0.4-1mm/sec.
PCB alignment x/y ± 8 mm, Theta: ± 2⁰
Options
Manual Optical positioning system
Cameras (2) manual adjustable CCD cameras
Fiducials (2) fiducials or any structure in PCB layout
Fiducials Size 0,7 – 3mm2
Fiducial position anywhere on PCB
Machine control
Hardware Microprocessor controlled, LCD display
Memory 99 PCB profiles
Inline Automatic Stencil printer
PCB Handling
PCB size min.: 80 x 50 mm
PCB size max.: 350 x 350 mm
PCB thickness max.: 0,5 -6 mm
PCB clearance underside 23 mm
PCB clearance top and bottom side 2.5mm, needed for PCB transport & clamping 0 mm for top side using side clamping.
PCB transport height 830 – 950 mm
PCB support magnetic support pins and bars
PCB hold down PCB clamping with knife edge from top or side clamping
PCB transport width adjustment motorized, software controlled
PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness
Stencil size 300 x 300 mm, up to 737 x 737 mm
Frame thickness 25 – 40 mm, adjustable without adapter
Print Parameter
Print area max. : 350 x 350 mm
Print speed 5-199 mm/sec.
Print head two independent pneumatic printheads, closed loop system, self-leveling squeegees.
Print pressure 0-240 N
Snap-off speed 0,2 – 10 mm/sec.
Snap-off distance 0 -3 mm
Snap-off -2 - +6 mm
PCB alignment x/y: ±4mm, Theta: ±2⁰
Vision System
Fiducials 2 -4 fiducials or any shape on PCB layout
Fiducial size 0,7 – 3 mm2
Camera EVA™ Vision system with 2 CCD Cameras
Camera field of view 10 x 8 mm
Fiducial position inside print area
Fiducail Teach Patented teach in method
Performance
Alignment repeatability 12,5 µm at 6 Sigma
Alignment accuracy 25 µm at 6 Sigma
Cycle time ˂ 12 sec. plus print
Set-Up ˂ 5 min.
Product changeover ˂ 3 min.
Advanced Flexible Component Placer
PCB Handling
PCB size min.: 50 x 40 mm
PCB size max.: 460 x 400 mm
PCB thickness: 0.38 – 4.2 mm
Movable PCB 3.0Kg
Feeder capacity
120 x 8mm tapes and 20 JEDEC trays with Tray Feeder
Feeder sizes: 8, 12, 16, 24, & 32mm, + vibratory feeders for ICs in plastic tubes
Fiducial Camera - mainly used for component position check and fiducial mark recognition during teaching.
The Flying Vision System utilizes separate camera (FOV16mm) for each of the heads. Standard packages and chip components can be picked-up and recognized simultaneously, resulting in high speed placement
Fix Camera (FOV45mm) mainly used for recognition of large parts, different-shaped parts, or split recognition.
High Flexibility (Component size)
0402 ~ 55mm
Connectors up to 75 mm
BGA, CSP
Max. Height: 15mm
High Efficiency
Quick job change through sharing of part library
Job change in accordance with the application of the feeder workstation and docking cart
High Reliability
Micro chip placement accuracy: ± 50µm
Fast & Flexible Component Placer (Chip Shooter)
PCB Handling
PCB size min.: 50 x 40 mm
PCB size max.: 460 x 400 mm
PCB thickness: 0.38 – 4.2 mm
Movable PCB 3.0Kg
Feeder capacity
112 x 8mm tapes and 20 JEDEC trays with Tray Feeder
Feeder sizes: 8, 12, 16, 24, & 32mm, + vibratory feeders for ICs in plastic tubes
Fiducial Camera - mainly used for component position check and fiducial mark recognition during teaching.
The Flying Vision System utilizes separate camera (FOV16mm) for each of the heads. Standard packages and chip components can be picked-up and recognized simultaneously, resulting in high speed placement
Fix Camera (FOV45mm) mainly used for recognition of large parts, different-shaped parts, or split recognition.
High Flexibility (Component size)
0402 ~ 55mm
Connectors up to 75 mm
BGA, CSP
Max. Height: 15mm
High Efficiency
Quick job change through sharing of part library
Job change in accordance with the application of the feeder workstation and docking cart
supports high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free layout for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling. The 1707 MK III is a streamline oven with even more advanced features including a five-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
Computer-controlled automatic lubrication system for "hands-off" maintenance
Six-sigma reliability for the most demanding production environments
Rapid profiling changes plus fast warm-up and cool-down
Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile
(Reflow Oven)
high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free layout for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling. The 1700 is a streamline oven with even more advanced features including a three-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
Computer-controlled automatic lubrication system for "hands-off" maintenance
Six-sigma reliability for the most demanding production environments
Rapid profiling changes plus fast warm-up and cool-down
Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile
(Lead Free Wave Soldering)
Selective Soldering
Wave Soldering
Hand Soldering
Lead Forming & Trimming
Press Fit
Rework, Process & Verification
Aqua Klean Systems (PCBA Wash)
enclosed cabinet closed loop system is built to supply the correct flow rates and pressures to one inline cleaner.