Quality is our #1 “Goal to meet and exceed our Customers’   Expectations”

Here are areas we exceed in.

• DPPM = Defective Parts Per million – Goal is 300 DPPM
• SPC = Statistical Process Control
• Chart types Pareto, Bar, X bar and Y, Cause and effect
• Cause of defect – Root cause and effect process
• We Build the Quality in our process to prevent any returns from our customer.
• We keep our employees up to date on all Quality improvements.
• Every build on the production line has work Instruction that follows the process to completion. With Employees signature at each Work station with Quality Check Points signed off by QA personnel

Quality PCB - final assembly inspection machines info

1. X-Ray Machine
   • can provide high-resolution images of BGA’s , Micro BGA’s and other chip scale packages
     • 75kV, 0.250mA, X-Ray Source
     • Digital X-Ray Control
     • 4'' Image Intensifier
     • 25X - 200X Magnification
     • Up to 18'' x 27'' PCB
     • Manual X-Y table
     • Image Analysis Software

 
 
 
 
 
 
- PCB Equipment & Testing Capability (with other vendors)
       

1. More PCB equipment info

1. Semi-Automatic Stencil Printer
   • PCB Handling
     • PCB size max.: 430 x 570 mm with standard PCB clamping: 350 x 450 mm
     • PCB thickness max.: 6 mm
     • Stencil size min. 300 x 300 mm, up to 630 x 850 mm.
     • Frame thickness 30 mm, adjustable without adapter
   • Print Parameter
     • Print area max. : 430 x 570 mm
     • Print speed 10-110 mm/sec.
     • Print pressure 0-4 bar
     • Separation speed 0.4-1mm/sec.
     • PCB alignment x/y ± 8 mm, Theta: ± 2⁰

 

• Options
  • Manual Optical positioning system
  • Cameras (2) manual adjustable CCD cameras
  • Fiducials (2) fiducials or any structure in PCB layout
  • Fiducials Size 0,7 – 3mm2
  • Fiducial position anywhere on PCB
• Machine control
  • Hardware Microprocessor controlled, LCD display
  • Memory 99 PCB profiles

 
 

1. Inline Automatic Stencil printer
   • PCB Handling
     • PCB size min.: 80 x 50 mm
     • PCB size max.: 350 x 350 mm
     • PCB thickness max.: 0,5 -6 mm
     • PCB clearance underside 23 mm
     • PCB clearance top and bottom side 2.5mm, needed for PCB transport & clamping 0 mm for top side using side clamping.
     • PCB transport height 830 – 950 mm
     • PCB support magnetic support pins and bars
     • PCB hold down PCB clamping with knife edge from top or side clamping
     • PCB transport width adjustment motorized, software controlled
     • PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness
     • Stencil size 300 x 300 mm, up to 737 x 737 mm
     • Frame thickness 25 – 40 mm, adjustable without adapter
   • Print Parameter
     • Print area max. : 350 x 350 mm
     • Print speed 5-199 mm/sec.
     • Print head two independent pneumatic printheads, closed loop system, self-leveling squeegees.
     • Print pressure 0-240 N
     • Snap-off speed 0,2 – 10 mm/sec.
     • Snap-off distance 0 -3 mm
     • Snap-off -2 - +6 mm
     • PCB alignment x/y: ±4mm, Theta: ±2⁰
   • Vision System
     • Fiducials 2 -4 fiducials or any shape on PCB layout
     • Fiducial size 0,7 – 3 mm2
     • Camera EVA™ Vision system with 2 CCD Cameras
     • Camera field of view 10 x 8 mm
     • Fiducial position inside print area
     • Fiducail Teach Patented teach in method
   • Performance
     • Alignment repeatability 12,5 µm at 6 Sigma
     • Alignment accuracy 25 µm at 6 Sigma
     • Cycle time ˂ 12 sec. plus print
     • Set-Up ˂ 5 min.
     • Product changeover ˂ 3 min.

 
 

1. Advanced Flexible Component Placer
   • PCB Handling
     • PCB size min.: 50 x 40 mm
     • PCB size max.: 460 x 400 mm
     • PCB thickness: 0.38 – 4.2 mm
     • Movable PCB 3.0Kg
   • Feeder capacity
     • 120 x 8mm tapes and 20 JEDEC trays with Tray Feeder
     • Feeder sizes: 8, 12, 16, 24, & 32mm, + vibratory feeders for ICs in plastic tubes
   • Pick & Place Cycle time
     • Chips at 21,000 CPH (1608)
     • ICs (15,000 CPH (SOP16), 5,500 CPH (QFP100), 5,500 CPH (BGA256)
   • Vision Recognition System
     • Fiducial Camera  - mainly used for component position check and fiducial mark recognition during teaching.
     • The Flying Vision System utilizes separate camera (FOV16mm) for each of the heads. Standard packages and chip components can be picked-up and recognized simultaneously, resulting in high speed placement
     • Fix Camera (FOV45mm) mainly used for recognition of large parts, different-shaped parts, or split recognition.
   • High Flexibility (Component size)
     •  0402 ~ 55mm
     • Connectors up to 75 mm
     • BGA, CSP
     • Max. Height: 15mm
   •  High Efficiency
     • Quick job change through sharing of part library
     • Job change in accordance with the application of the feeder workstation and docking cart
   • High Reliability
     • Micro chip placement accuracy: ± 50µm

 

1. Fast & Flexible Component Placer (Chip Shooter)
   • PCB Handling
     • PCB size min.: 50 x 40 mm
     • PCB size max.: 460 x 400 mm
     • PCB thickness: 0.38 – 4.2 mm
     • Movable PCB 3.0Kg
   • Feeder capacity
     • 112 x 8mm tapes and 20 JEDEC trays with Tray Feeder
     • Feeder sizes: 8, 12, 16, 24, & 32mm, + vibratory feeders for ICs in plastic tubes
   • Pick & Place Cycle time
     • Chips at 39,000 CPH (1608)
     • ICs (15,000 CPH (SOP16), 5,500 CPH (QFP100), 5,500 CPH (BGA256)
   • Vision Recognition System
     • Fiducial Camera  - mainly used for component position check and fiducial mark recognition during teaching.
     • The Flying Vision System utilizes separate camera (FOV16mm) for each of the heads. Standard packages and chip components can be picked-up and recognized simultaneously, resulting in high speed placement
     • Fix Camera (FOV45mm) mainly used for recognition of large parts, different-shaped parts, or split recognition.
   • High Flexibility (Component size)
     • 0402 ~ 55mm
     • Connectors up to 75 mm
     • BGA, CSP
     • Max. Height: 15mm
   •  High Efficiency
     • Quick job change through sharing of part library
     • Job change in accordance with the application of the feeder workstation and docking cart
   • High Reliability
     • Micro chip placement accuracy: ± 50µm (0402 chip, micro CSP, IC)

 

1.  (Reflow Oven)
   • supports high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free layout for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling. The 1707 MK III is a streamline oven with even more advanced features including a five-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
     • Computer-controlled automatic lubrication system for "hands-off" maintenance
     • Six-sigma reliability for the most demanding production environments
     • Rapid profiling changes plus fast warm-up and cool-down
     • Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile

 

1.  (Reflow Oven)
   • high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free layout for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling. The 1700 is a streamline oven with even more advanced features including a three-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.
     • Computer-controlled automatic lubrication system for "hands-off" maintenance
     • Six-sigma reliability for the most demanding production environments
     • Rapid profiling changes plus fast warm-up and cool-down
     • Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile

 

1.  (Lead Free Wave Soldering)
   • Selective Soldering
   • Wave Soldering
   • Hand Soldering
   • Lead Forming & Trimming
   • Press Fit
   • Rework, Process & Verification

 

1. Aqua Klean Systems (PCBA Wash)
   • enclosed cabinet closed loop system is built to supply the correct flow rates and pressures to one inline cleaner.
     • Pre & Post- Filtration
     • Resistivity Meter: 0-18 megohm
     • PCBA Wash baskets